Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Including heating
Patent
1988-11-07
1991-06-18
Bowers, Jr., Charles L.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Including heating
430326, 430192, 430169, G03F 7023, G03F 738
Patent
active
050249223
ABSTRACT:
Positive working polyamic acid photoresist compositions are disclosed having improved high resolution upon image development and exhibiting stable photosensitivity and superior dielectric performance. The compositions comprise polyamic acid condensation products of an aromatic dianhydride and an aromatic di-primary amine wherein a percentage of the diamine comprises special dissolution inhibiting monomers. The compositions may be further improved by the presence of particular supplemental additives.
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Spak, M. A., "High Temperature Post Exposure Bake (HTPEB) for Az.RTM. 4000 Photoresist", SPIE vol. 59 Advances in Resist Tech. & Proc. II, 1985, pp. 299-307.
Brewer Terry
Cuzmar Ruth M.
Flaim Tony D.
Hawley Dan W.
Moss Mary G.
Bowers Jr. Charles L.
Peoples, Jr. Veo
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