Positive type radiation-sensitive resin composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S913000

Reexamination Certificate

active

07488566

ABSTRACT:
A positive type radiation-sensitive resin composition suitable as a chemically-amplified resist sensitive to active radiation particularly to deep ultraviolet rays represented by a KrF excimer laser, an ArF excimer laser, or an F2excimer laser, excelling particularly in a process margin for the KrF excimer laser is provided. The positive type radiation-sensitive resin composition comprises a photoacid generator and an acid-labile group-containing resin which is insoluble or scarcely soluble in alkali, but becomes alkali-soluble by the action of an acid, wherein the photoacid generator is a mixed photoacid generator containing a photoacid generator of the following formula (1) and a photoacid generator which is at least one compound selected from sulfonyloxyimide and disulfonyldiazomethane.

REFERENCES:
patent: 2002/0192593 (2002-12-01), Nagai et al.
patent: 2003/0113660 (2003-06-01), Yoneda et al.
patent: 2004/0166432 (2004-08-01), Ohsawa et al.
patent: 2005/0244747 (2005-11-01), Nagai et al.
patent: 2006/0078821 (2006-04-01), Shimizu et al.
patent: 2006/0166138 (2006-07-01), Shimizu et al.
patent: 1 238 972 (2002-09-01), None
patent: 07-138249 (1995-05-01), None
patent: 07-319163 (1995-12-01), None
patent: 2001-075283 (2001-03-01), None
patent: 2004-219963 (2004-08-01), None
patent: 2004219963 (2004-08-01), None

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