Positive type photosensitive epoxy resin composition and...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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C430S012000, C430S280100

Reexamination Certificate

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11471871

ABSTRACT:
A printed circuit board comprising an insulating layer prepared with the aid of a positive type photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule; (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent, and (d) a photosensitive acid generator.

REFERENCES:
patent: 4556628 (1985-12-01), Greschner et al.
patent: 0933681 (1999-08-01), None
patent: 1998-013546 (1998-04-01), None

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