Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2010-01-19
2010-12-28
Lee, Calvin (Department: 2892)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C216S044000
Reexamination Certificate
active
07858528
ABSTRACT:
Methods of patterning a substrate including creating a multi-layered structure by forming, on the substrate, a patterned layer having protrusions and recessions are described. A polymerizable material composition is dispense on the patterned layer defining a conformal layer, with the multi-layered structure having a crown surface facing away from the substrate. Portions of the multi-layered structure are removed to expose regions of the substrate in superimposition with the protrusions, while forming a hard mask in areas of the crown surface in superimposition with the recessions.
REFERENCES:
patent: 7179396 (2007-02-01), Sreenivasan
patent: 7261831 (2007-08-01), Sreenivasan
patent: 7670953 (2010-03-01), Sreenivasan
Lee Calvin
Molecular Imprints, Inc.
Robinson Laura C.
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