Positive resist system having high resistance to oxygen reactive

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430326, 430311, 430313, 430323, 430176, 430914, 430921, 430922, 430925, 430919, G03C 516, G03C 1495, G03F 726

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active

046650067

ABSTRACT:
A photoresist composition comprised of a radiation scissionable polymeric system having organopolysiloxane segments sensitized by an onium salt is disclosed. Useful organopolysiloxane containing polymers include polysiloxane-polycarbonate block copolymers, and polyorganosiloxane polyaryl esters. The resist films produced from the photoresist compositions exhibit high sensitivity, high thermal stability and resistance to oxygen reactive ion etching which makes them desirable for dry etching processes to enable submicron resolution.

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S. J. Gillespie, "Shaped Siloxane Process", IBM Technical Disclosure Bulletin, vol. 26, No. 7B Dec. 1983, pp. 3965-3966.
IBM Technical Disclosure Bulletin, vol. 23, No. 8 Jan. 1981, Photoinitiated Doping, p. 3852.

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