Positive resist compositions and patterning process

Details Positive resist compositions and patterning process Positive resist compositions and patterning process

2007-08-14

2007-08-14

Lee, Sin (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C430S914000, C430S330000, C430S910000, C430S907000

Reexamination Certificate

active

11101568

ABSTRACT:
A polymer comprising units derived from an exo-form ester and units derived from an ester having two hexafluoroisopropanol groups is used as a base resin to formulate a positive resist composition which, when exposed and developed by photolithography, is minimized in line edge roughness by swelling during development and residue after development, and improved in adhesion.

REFERENCES:
patent: 4491628 (1985-01-01), Ito et al.
patent: 5310619 (1994-05-01), Crivello et al.
patent: 5968713 (1999-10-01), Nozaki et al.
patent: 6013416 (2000-01-01), Nozaki et al.
patent: 6200725 (2001-03-01), Takechi et al.
patent: 6280898 (2001-08-01), Haswgawa et al.
patent: 6329125 (2001-12-01), Takechi et al.
patent: 6448420 (2002-09-01), Kinsho et al.
patent: 2001/0003640 (2001-06-01), Takechi et al.
patent: 2001/0026901 (2001-10-01), Maeda et al.
patent: 2005/0084796 (2005-04-01), Hatakeyama et al.
patent: 63-27829 (1988-02-01), None
patent: 2-27660 (1990-06-01), None
patent: 9-73173 (1997-03-01), None
patent: 9-90637 (1997-04-01), None
patent: 9-230595 (1997-09-01), None
patent: 10-10739 (1998-01-01), None
patent: 2000-26446 (2000-01-01), None
patent: 2000-159758 (2000-06-01), None
patent: 2000-327633 (2000-11-01), None
patent: 2005-70531 (2005-03-01), None
patent: WO-97/33198 (1997-09-01), None
Hiroshi Ito et al., Proc. SPIE vol. 3999, (2000), pp. 2-12.
H. Ito et al., J. Photopolym. Sci and Technol., vol. 16, No. 4, (1993), pp. 523-536.

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