Positive resist compositions and patterning process

Details Positive resist compositions and patterning process Positive resist compositions and patterning process

2008-05-06

2008-05-06

Lee, Sin (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C430S330000, C430S910000, C430S914000

Reexamination Certificate

active

07368218

ABSTRACT:
A polymer which is obtained from a combination of (meth)acrylate having a bridged ring lactone group and (meth)acrylate having an acid leaving group with a hexafluoroalcohol group is used as a base resin to formulate a positive resist composition which when exposed to high-energy radiation and developed, exhibits a high sensitivity, a high resolution, and a minimal line edge roughness due to controlled swell during development. The composition also has excellent dry etching resistance.

REFERENCES:
patent: 4491628 (1985-01-01), Ito et al.
patent: 5310619 (1994-05-01), Crivello et al.
patent: 5968713 (1999-10-01), Nozaki et al.
patent: 6013416 (2000-01-01), Nozaki et al.
patent: 6200725 (2001-03-01), Takechi et al.
patent: 6280898 (2001-08-01), Hasegawa et al.
patent: 6329125 (2001-12-01), Takechi et al.
patent: 6448420 (2002-09-01), Kinsho et al.
patent: 6746818 (2004-06-01), Kinsho et al.
patent: 2001/0003640 (2001-06-01), Takechi et al.
patent: 2001/0026901 (2001-10-01), Maeda et al.
patent: 2005/0208419 (2005-09-01), Inabe et al.
patent: 63-27829 (1988-02-01), None
patent: 2-27660 (1990-06-01), None
patent: 9-73173 (1997-03-01), None
patent: 9-90637 (1997-04-01), None
patent: 9-230595 (1997-09-01), None
patent: 10-10739 (1998-01-01), None
patent: 2000-26446 (2000-01-01), None
patent: 2000-159758 (2000-06-01), None
patent: 2000-327633 (2000-11-01), None
patent: 2002-371114 (2002-12-01), None
patent: 2003-40480 (2003-02-01), None
patent: WO-97/33198 (1997-09-01), None
In Advances in Resist Technology and Processing XVII, Proceedings of SPIE vol. 3999 (2000), “Dissolution/swelling behavior of cycloolefin polymers in aqueous base”, Hiroshi Ito et al., pp. 2-12.
Advances in Resist Technology and Processing XX, Proceedings of SPIE vol. 5039 (2003), “Hydrogen bonding and aqueous base dissolution behavior of hexafluoroisopropanol-bearing polymers”, Hiroshi Ito et al., pp. 70-79.
Advances in Resist Technology and Processing XX, Proceedings of SPIE vol. 5039 (2003), “Rational Design in Cyclic Olefin Resists for Sub-100nm Lithography”, pp. 61-69.
Journal of Photopolymer Science and Technology, vol. 16, No. 4 (2003), “Fluoropolymer Resists: Progress and Properties”, H. Ito et al., pp. 523-536.

Affiliated with

Also associated with

Rating

Positive resist compositions and patterning process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Positive resist compositions and patterning process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Positive resist compositions and patterning process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2813327