Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2011-08-09
2011-08-09
Lee, Sin J. (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S311000, C430S326000, C430S330000, C430S910000, C430S921000, C430S925000, C430S942000
Reexamination Certificate
active
07993811
ABSTRACT:
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising specific recurring units, represented by formula (1). The acid generator (B) is a specific sulfonium salt compound. When processed by lithography, the composition is improved in resolution and forms a pattern with a satisfactory mask fidelity and a minimal LER.Herein R1is H or methyl, R2is an acid labile group, R3is CO2R4when X is CH2, R3is H or CO2R4when X is O, R4is a monovalent C1-C20hydrocarbon group, and m is 1 or 2.
REFERENCES:
patent: 5714625 (1998-02-01), Hada et al.
patent: 6004724 (1999-12-01), Yamato et al.
patent: 6063953 (2000-05-01), Hada et al.
patent: 6261738 (2001-07-01), Asakura et al.
patent: 6312867 (2001-11-01), Kinsho et al.
patent: 6329125 (2001-12-01), Takechi et al.
patent: 6512020 (2003-01-01), Asakura et al.
patent: 6849374 (2005-02-01), Cameron et al.
patent: 6893792 (2005-05-01), Miya et al.
patent: 6908722 (2005-06-01), Ebata et al.
patent: 6916591 (2005-07-01), Ohsawa et al.
patent: 7399577 (2008-07-01), Yamato et al.
patent: 2005/0147920 (2005-07-01), Lin et al.
patent: 2006/0228648 (2006-10-01), Ohsawa et al.
patent: 2007/0003871 (2007-01-01), Kodama et al.
patent: 2007/0078269 (2007-04-01), Harada et al.
patent: 2007/0231738 (2007-10-01), Kaneko et al.
patent: 2009/0234155 (2009-09-01), Oh et al.
patent: 2009/0291390 (2009-11-01), Jung et al.
patent: 1 517 179 (2005-03-01), None
patent: 1 710 230 (2006-10-01), None
patent: 1 780 199 (2007-05-01), None
patent: 2906999 (1995-11-01), None
patent: 9-73173 (1997-03-01), None
patent: 9-90637 (1997-04-01), None
patent: 9-95479 (1997-04-01), None
patent: 9-208554 (1997-08-01), None
patent: 9-230588 (1997-09-01), None
patent: 9-301948 (1997-11-01), None
patent: 2000-314956 (2000-11-01), None
patent: 2000-336121 (2000-12-01), None
patent: 2002-214774 (2002-07-01), None
patent: 2004-2252 (2004-01-01), None
patent: 2004-4561 (2004-01-01), None
patent: 2004-531749 (2004-10-01), None
patent: 2006-306856 (2006-11-01), None
patent: 2007-145797 (2007-06-01), None
patent: 2007-297590 (2007-11-01), None
patent: WO-2004/074242 (2004-09-01), None
Houlihan et al., Journal of Photopolymer Science and Technology, vol. 19, No. 3, 2006, pp. 327-334.
Choi et al., Journal of Photopolymer Science and Technology, vol. 19, No. 3, 2006, pp. 313-318.
Varanasi et al., Journal of Photopolymer Science and Technology, vol. 18, No. 3, 2005, pp. 381-387.
Arimitsu et al., Journal of Photopolymer Science and Technology, vol. 8, No. 1, 1995, pp. 43-46.
Arimitsu et al., Journal of Photopolymer Science and Technology, vol. 9, No. 1, 1996, pp. 29-30.
Kinsho Takeshi
Ohsawa Youichi
Watanabe Takeru
Birch & Stewart Kolasch & Birch, LLP
Lee Sin J.
Shin-Etsu Chemical Co. , Ltd.
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