Positive resist composition and patterning process

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S326000, C430S330000, C430S907000, C430S910000, C430S942000

Reexamination Certificate

active

08062828

ABSTRACT:
A positive resist composition comprises a polymer comprising recurring units having a sulfonium salt incorporated therein as a base resin which becomes soluble in alkaline developer under the action of acid. The polymer generates a strong sulfonic acid upon exposure to high-energy radiation so as to facilitate effective scission of acid labile groups in the resist composition.

REFERENCES:
patent: 5945250 (1999-08-01), Aoai et al.
patent: 6048672 (2000-04-01), Cameron et al.
patent: 6830866 (2004-12-01), Kobayashi et al.
patent: 6849374 (2005-02-01), Cameron et al.
patent: 7288359 (2007-10-01), Iwasawa et al.
patent: 7449573 (2008-11-01), Kodama et al.
patent: 2002/0197558 (2002-12-01), Ferreira et al.
patent: 2003/0113659 (2003-06-01), Hatakeyama et al.
patent: 2003/0224284 (2003-12-01), Tao
patent: 2004/0260031 (2004-12-01), Takeda et al.
patent: 2006/0147836 (2006-07-01), Hatakeyama et al.
patent: 2006/0228648 (2006-10-01), Ohsawa et al.
patent: 2007/0003871 (2007-01-01), Kodama et al.
patent: 2007/0149702 (2007-06-01), Ando et al.
patent: 2007/0207408 (2007-09-01), Hatakeyama et al.
patent: 2007/0218401 (2007-09-01), Ando et al.
patent: 2007/0231738 (2007-10-01), Kaneko et al.
patent: 2010/0075256 (2010-03-01), Joo et al.
patent: 2049772 (1992-02-01), None
patent: 4-230645 (1992-08-01), None
patent: 11-282168 (1999-10-01), None
patent: 2000-122296 (2000-04-01), None
patent: 2002-214774 (2002-07-01), None
patent: 2003-066612 (2003-03-01), None
patent: 2003-140332 (2003-05-01), None
patent: 2004-002252 (2004-01-01), None
patent: 2004-115630 (2004-04-01), None
patent: 2004-531749 (2004-10-01), None
patent: 3613491 (2004-11-01), None
patent: 2005-008766 (2005-01-01), None
patent: 2005-084365 (2005-03-01), None
patent: 2005-266766 (2005-09-01), None
patent: 2006-178317 (2006-07-01), None
patent: 2007-197718 (2007-08-01), None
patent: 2007-297590 (2007-11-01), None
patent: WO-2006/121096 (2006-11-01), None
Derwent English abstract for JP2006-178317.
Machine-assisted English translation of JP2006-178317, as provided by JPO.
Dammel, et al., “193 nm Immersion Lithography—Taking the Plunge”, Journal of Photopolymer Science and Technology, vol. 17, No. 4 (2004), pp. 587-601.
Armitsu, et al., “Sensitivity Enhancement of Chemical-Amplification-Type Photoimaging Materials by Acetoacetic Acid Derivatives” Journal of Photopolymer Science and Technology, vol. 8, No. 1 (1995), pp. 43-44.
Kudo, et al., “Enhancement of the Sensitivity of Chemical-Amplification-Type Photoimaging Materials by β-Tosyloxyketone Acetals” Journal of Photopolymer Science and Technology, vol. 8, No. 1 (1995), pp. 45-46.
Arimitsu, et al., “Effect of Phenolic Hydroxyl Residues on the Improvement of Acid-Proliferation-Type Photoimaging Materials”, Journal of Pholopolymer Science and Technology, vol. 9, No. 1 (1996), pp. 29-30.

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