Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2008-03-28
2009-12-22
Lee, Sin J. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S326000, C430S907000, C430S910000, C430S921000, C430S925000
Reexamination Certificate
active
07635554
ABSTRACT:
A positive photosensitive composition comprises: (A) a resin that has an acid decomposable repeating unit represented by formula (I) and increases its solubility in an alkali developer by action of an acid: (B) a compound generating an acid upon irradiation with actinic light or radiation; (C) a hydrophobic resin insoluble in an alkali developer and having at least either one of a fluorine atom and a silicon atom; and (D) a solvent,wherein in the formula (I), Xa1represents a hydrogen atom, an alkyl group, a cyano group or a halogen atom, Ry1to Ry3each independently represents an alkyl group or a cycloalkyl group, and at least two of Ry1to Ry3may be coupled to form a ring structure, and Z represents a divalent linking group.
REFERENCES:
patent: 2005/0069819 (2005-03-01), Shiobara
patent: 2006/0246373 (2006-11-01), Wang
patent: 2007/0134588 (2007-06-01), Kanda et al.
patent: 2007/0134589 (2007-06-01), Yamamoto et al.
patent: 1 795 960 (2007-06-01), None
patent: 57-153433 (1982-09-01), None
patent: 2002-303978 (2002-10-01), None
patent: 2004/068242 (2004-08-01), None
patent: 2005/003198 (2005-01-01), None
B. J. Lin, “Semiconductor Foundry, Lithography, and Partners”, Proc. SPIE, Emerging Lithographic Technologies VI, 2002, pp. 11-24, vol. 4688.
J.A. Hoffnagle, et al., “Liquid Immersion Deep-Ultraviolet Interferometric Lithography”, J. Vac. Sci. Techonol. B, Nov./Dec. 1999, pp. 3306-3309, vol. 17, No. 6, American Vacuum Society.
Hiroshi Ito, et al., “Dissolution/Swelling Behavior of Cycloolefin Polymers in Aqueous Base”, Advances in Resist Technology and Processing XVII, 2000, pp. 2-12, Proceedings of SPIE.
Fukuhara Toshiaki
Kanda Hiromi
Kanna Shinichi
FUJIFILM Corporation
Lee Sin J.
Sughrue & Mion, PLLC
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