Positive resist composition and pattern forming method...

Details Positive resist composition and pattern forming method... Positive resist composition and pattern forming method...

2007-11-06

2007-11-06

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C430S905000, C430S910000

Reexamination Certificate

active

11210672

ABSTRACT:
A positive resist composition comprising: a resin that comprises a repeating unit including a specific norbornane lactone structure and a repeating unit including a specific alicyclic hydrocarbon structure, and that increases a solubility of the resin in an alkaline developer by an action of an acid; and a compound that generates an acid upon treatment with one of an actinic ray and radiation, and a pattern forming method utilizing the same.

REFERENCES:
patent: 6280898 (2001-08-01), Hasegawa et al.
patent: 6492091 (2002-12-01), Kodama et al.
patent: 6579659 (2003-06-01), Uetani et al.
patent: 6673518 (2004-01-01), Nishi et al.
patent: 7037995 (2006-05-01), Watanabe et al.
patent: 2001/0026901 (2001-10-01), Maeda et al.
patent: 2004/0146802 (2004-07-01), Yamamoto et al.
patent: 1 143 299 (2001-10-01), None
patent: 1 681 307 (2006-07-01), None
patent: 2000-159758 (2000-06-01), None
patent: 2001-109154 (2001-04-01), None
patent: 2002-212174 (2002-07-01), None
patent: 2002-296783 (2002-10-01), None
European Search Report dated Apr. 5, 2007.

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