Positive resist composition and pattern formation method...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S326000, C430S910000

Reexamination Certificate

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11041384

ABSTRACT:
A positive resist composition which can be suitably used in an ultramicrolithography process such as production of VLSI or high-capacity microchip and in other photofabrication processes and can ensure good sensitivity, resolution, pattern profile and line edge roughness when irradiated with actinic rays or radiation, particularly, electron beam, X-ray or EUV; and a pattern formation method using the composition, are provided, the positive resist composition comprising (A) a resin comprising a specific acryl-based repeating unit and a specific styrene-based repeating unit, which increases the dissolution rate in an alkali developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation, and (C) a solvent; and a pattern formation method using the composition.

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patent: 2003-322970 (2003-11-01), None
patent: 2003-322970 (2003-11-01), None
Machine-assisted English translation of JP 2003-322970 (Hirayama et al) provided by JPO.
T. Fischer et al., Proc. SPIE, vol. 2483, pp. 53-60 (1995) Influence of acid generator structure on T-top formation in high temperature bake processes for environmental stabilization.
Akio Naka, “Resist Composition and Method for Forming Resist Pattern by Using the Same”, Patent Abstracts of Japan—2000 131847 (2000).
Juichi Takayama, “Positive Resist Composition and Method for Forming Pattern by Using the Same”, Patent Abstracts of Japan—2003 322970 (2003).
European Search Report dated Jun. 9, 2005.

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