Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2007-03-20
2007-03-20
Hamilton, Cynthia (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S326000
Reexamination Certificate
active
10931958
ABSTRACT:
A positive resist composition capable of realizing an improvement in resolution, a reduction in LER, and a reduction in the level of defects, as well as a method of forming a resist pattern. This composition and method provide:a positive resist composition comprising a resin component (A) containing a structural unit (a1) derived from an (α-methyl)hydroxystyrene, represented by a general formula (1) shown below, and a structural unit (a2) represented by a general formula (2) shown below, wherein the solubility rate of the component (A) in a 2.38% by weight aqueous solution of TMAH (tetramethylammonium hydroxide) is within a range from 100 to 1000 Å/second, as well as a method of forming a resist pattern that uses such a composition;(wherein in the general formulas (1) and (2), R represents a hydrogen atom or a methyl group).
REFERENCES:
patent: 4491628 (1985-01-01), Ito et al.
patent: 0 401 499 (1990-12-01), None
patent: 0733952 (1996-09-01), None
patent: 02-27660 (1990-06-01), None
patent: 04-287044 (1992-10-01), None
patent: 05-040342 (1993-02-01), None
patent: 05-313372 (1993-11-01), None
patent: 06-130670 (1994-05-01), None
patent: 06-287163 (1994-10-01), None
patent: 07-285918 (1995-10-01), None
patent: 08-193052 (1996-07-01), None
patent: 08-193054 (1996-07-01), None
patent: 08-193055 (1996-07-01), None
patent: 08-245515 (1996-09-01), None
patent: 09-07720 (1997-03-01), None
patent: 10-268508 (1998-10-01), None
patent: 2001-142217 (2001-05-01), None
patent: 285719 (1996-09-01), None
Matsumoto et al, “Hydrogenated Poly(p-vinylphenol) for Microlithography”, Ind. Eng. CHem. Res. 1996, pp. 2414-2419.
Lange's Handbook of Chemistry (15thEd), McGraw-Hill, 1999, Secion 1, 1.1 to 1.1.2.2, edited by Dean, J.A.
Chatzichristidi et al, “partially hydrogenated poly(vinly phenol) based photoresist for near UV, high aspect raito machining”. K/Va/c Sco/ Tecjmp;/ B 2- 96), Nov./Dec. 2002 pp. 2968-2972.
Nitta Kazuyuki
Ohkubo Waki
Shimatani Satoshi
Hamilton Cynthia
Knobbe Martens Olson and Bear LLP
Tokyo Ohka Kogyo Co. Ltd.
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