Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2003-12-18
2010-02-23
Chu, John S (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S905000, C430S910000
Reexamination Certificate
active
07666569
ABSTRACT:
A positive resist composition including a resin component (A) containing an acid dissociable dissolution inhibiting group whose alkali solubility increases under action of acid and an acid generator component (B) that generates acid on exposure, wherein the resin component (A) is a copolymer comprising a first structural unit (a1) derived from a hydroxystyrene and a second structural unit (a2) derived from a (meth)acrylate ester containing an alcoholic hydroxyl group, in which 10 mol % or more and 25 mol % or less of a combined total of hydroxyl groups within the structural units (a1) and alcoholic hydroxyl groups within the structural units (a2) are protected with the acid dissociable dissolution inhibiting groups, and a weight average molecular weight of the copolymer prior to protection with the acid dissociable dissolution inhibiting groups is 2,000 or more and 8,500 or less.
REFERENCES:
patent: 5942367 (1999-08-01), Watanabe et al.
patent: 5976759 (1999-11-01), Urano et al.
patent: 6033826 (2000-03-01), Urano et al.
patent: 6048661 (2000-04-01), Nishi et al.
patent: 6143460 (2000-11-01), Kobayashi et al.
patent: 6239231 (2001-05-01), Fujishima et al.
patent: 6288552 (2001-09-01), Palmgren
patent: 6432608 (2002-08-01), Fujie et al.
patent: 6495306 (2002-12-01), Uetani et al.
patent: 6495307 (2002-12-01), Uetani et al.
patent: 6511785 (2003-01-01), Takemura et al.
patent: 6593056 (2003-07-01), Takeda et al.
patent: 6627381 (2003-09-01), Uetani et al.
patent: 6630282 (2003-10-01), Oomori et al.
patent: 6656660 (2003-12-01), Urano et al.
patent: 6723483 (2004-04-01), Oono et al.
patent: 6787282 (2004-09-01), Sato
patent: 6846609 (2005-01-01), Uetani et al.
patent: 6949329 (2005-09-01), Endo et al.
patent: 7005230 (2006-02-01), Yamamoto et al.
patent: 7312014 (2007-12-01), Maesawa et al.
patent: 2001/0044070 (2001-11-01), Uetani et al.
patent: 2002/0025495 (2002-02-01), Ogata et al.
patent: 2002/0164540 (2002-11-01), Nakanishi et al.
patent: 2003/0232273 (2003-12-01), Adams et al.
patent: 2004/0033438 (2004-02-01), Hamada et al.
patent: 2005/0031984 (2005-02-01), Takata et al.
patent: 2005/0042541 (2005-02-01), Hagihara et al.
patent: 2006/0247346 (2006-11-01), Hojo et al.
patent: 2006/0251986 (2006-11-01), Sato et al.
patent: 2007/0042288 (2007-02-01), Hojo et al.
patent: 1 357 284 (2003-10-01), None
patent: 1357428 (2003-10-01), None
patent: 2 356 258 (2001-05-01), None
patent: 4-211258 (1992-08-01), None
patent: 06-069118 (1994-03-01), None
patent: 8-254820 (1996-10-01), None
patent: H10-142799 (1998-05-01), None
patent: H10-306120 (1998-11-01), None
patent: 11-119443 (1999-04-01), None
patent: H11-109631 (1999-04-01), None
patent: 11-168052 (1999-06-01), None
patent: 2000-26535 (2000-01-01), None
patent: 2000-086584 (2000-03-01), None
patent: 2000-188250 (2000-07-01), None
patent: 2000-214587 (2000-08-01), None
patent: 2000-356850 (2000-12-01), None
patent: 2001-056558 (2001-02-01), None
patent: 2001-142199 (2001-05-01), None
patent: 2001-166478 (2001-06-01), None
patent: 2001-274062 (2001-10-01), None
patent: 2002-055452 (2002-02-01), None
patent: 2002-062655 (2002-02-01), None
patent: 2002-062656 (2002-02-01), None
patent: 2002-241442 (2002-08-01), None
patent: 2002-287363 (2002-10-01), None
patent: 2002-323768 (2002-11-01), None
patent: 2002-373845 (2002-12-01), None
patent: 2003-075998 (2003-03-01), None
patent: 2003-107707 (2003-04-01), None
patent: 2003-107710 (2003-04-01), None
patent: 2003-295444 (2003-10-01), None
patent: 2004-012513 (2004-01-01), None
patent: 2004-078153 (2004-03-01), None
patent: 2004-333548 (2004-11-01), None
patent: 2004-333549 (2004-11-01), None
patent: WO 00/46640 (2000-08-01), None
patent: WO 01/73512 (2001-10-01), None
patent: WO 03/007079 (2003-01-01), None
Office Action Issued on Jul. 1, 2008, on the Japanese Patent Application No. 2004-142581.
Utsumi, “Low-energy E-Beam Proximity Lithography (LEEPL): Is the Simplest the Best?”, Japanese Journal of Applied Physics, vol. 38, Part 1, No. 12B, pp. 7046-7051 (1999).
Decision to Grant a Patent issued on Aug. 26, 2008 on the counterpart Japanese Application No. 2003-334029 of the related U.S. Appl. No. 10/572,709.
Nakamura et al., “Ultra Thin Film Resist for Low Energy E-beam Projection Lithography”, Journal of Photopolymer Science and Technology, vol. 15, No. 3, pp. 417-422, (2002).
Yoshizawa et al., “Comparative study of resolution limiting factors in electron beam lithography using the edge roughness evaluation method”, Journal of Vacuum Science and Technology B, vol. 19, Issue 6, pp. 2488-2493, (2001).
Office Action Issued on Feb. 19, 2008, on the Japanese Patent Application No. 2003-334029.
Office Action Issued on Feb. 19, 2008, on the Japanese Patent Application No. 2003-347136.
Decision to Grant a Patent issued on the corresponding Japanese Patent Application No. 2004-119494, dated Dec. 16, 2008.
Hagihara Mitsuo
Kawana Daisuke
Sato Kazufumi
Chu John S
Knobbe Martens Olson & Bear LLP
Tokyo Ohka Kogyo Co. Ltd.
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