Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2007-04-03
2007-04-03
Walke, Amanda (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S287100
Reexamination Certificate
active
10422789
ABSTRACT:
A positive resist composition comprising:(A1) a resin containing at least one type of repeating unit represented by the specific formula and additionally containing at least one type of repeating unit represented by the specific formula, which increases the solubility in an alkali developing solution by the action of an acid, and(B) a compound which is capable of generating an acid by the action of actinic ray or radiation.
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English language abstract of JP 04-50850.
English language abstract of JP 2003-005372.
English language translation of JP 04-050850.
T. Fujigaya et al., A New Photoresist Material for 157 nm Lithography-2, J. Photopolym. Sci. Technol., (2002) vol. 15, No. 4, pp. 643-654.
R.R. Kunz et al., Outlook for 157-nm resist design, Proc. SPIE vol. 3678 (1999) pp. 12-23.
Dirk Schmaljohann et al., Design Strategies for 157 nm Single-Layer Photoresists: Lithographic Evaluation of a Poly(α-trifluoromethyl vinyl alcohol) Copolymer, in Advances in Resist Technology and Processing XVII, Francis M. Houlihan, Editor, Proceedings of SPIE vol. 3999 (2000), pp. 330-334.
Michael K. Crawford et al., New Materials for 157 nm Photoresists: Characterization and Properties, in Advances in Resist Technology and Processing XVII, Francis M. Houlihan, Editor, Proceedings of SPIE vol. 3999 (2000), pp. 357-364.
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Kanna Shinichi
Mizutani Kazuyoshi
Sasaki Tomoya
Fujifilm Corporation
Walke Amanda
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