Positive photosensitive resin composition and method for...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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Details

C430S326000, C430S330000, C430S906000

Reexamination Certificate

active

07666573

ABSTRACT:
A positive photosensitive resin composition containing 100 parts by weight of a polyimide precursor (A) having a constituent unit represented by the formula (1), 15 to 25 parts by weight of a crosslinking agent (B) represented by the formula (2), and 2 to 5 parts by weight of a photosensitizer (C) generating acid upon irradiation of an actinic ray:wherein m is an integer of 1 or greater, and R is an aromatic group or an aliphatic group having a valency of 1 or higher. The positive photosensitive resin composition can be developed by using an aqueous solution of alkali metal carbonate, is capable of forming micropatterns, and has excellent thermal resistance and the like. A method for forming a positive pattern, and uses thereof are also provided.

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Shigeru Kubota, et al., “Positive Photoreactive Polyimides. II. Preparation and Characterization of Polyimide Precursors Containing α-(2-Nitrophenyl)Ethyl Ester Side Chains”, Mitsubishi Electric Corp., 1987, J. Macromol. Sci-Chem., A24 (12), pp. 1407-1422 (cited in pp. 3 in the Specification).
Recent Polyamides, NTS Corp., 2002 with partial English Translation, pp. 112-113, 280 and 401. (cited in pp. 4 & 8 in the Specification).

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