Positive photosensitive resin composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S281100, C430S286100, C430S913000

Reexamination Certificate

active

07371506

ABSTRACT:
A positive photosensitive resin composition comprising (A) a polyamic acid, (B) a 1,4-dihydropyridine derivative represented by the general formula (II):wherein R2is a monovalent organic group; each of R3, R4, R5, and R6is independently hydrogen or a monovalent organic group; and Ar—NO2is an aromatic hydrocarbon group having a nitro group at ortho-position, and (C) an amine compound.

REFERENCES:
patent: 5122436 (1992-06-01), Tunney et al.
patent: 5449584 (1995-09-01), Banba et al.
patent: 5858518 (1999-01-01), Omote et al.
patent: 6096482 (2000-08-01), Omote et al.
patent: 6300037 (2001-10-01), Fujii et al.
patent: 0 502 400 (1992-09-01), None
patent: 5-5995 (1993-01-01), None
patent: 5-113668 (1993-05-01), None
patent: 5-281717 (1993-10-01), None
patent: 2000290501 (2000-10-01), None
patent: 2001022063 (2001-01-01), None
English language machine translation of JP 2001-022063.

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