Positive photosensitive composition, pattern forming method...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S326000, C430S905000, C430S910000, C526S266000, C549S266000, C549S271000

Reexamination Certificate

active

08043791

ABSTRACT:
A positive photosensitive composition ensuring wide exposure latitude and reduced line edge roughness not only in normal exposure (dry exposure) but also in immersion exposure, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition are provided, which are a positive photosensitive composition comprising (A) a resin having a specific lactone structure in the side chain and being capable of increasing the solubility in an alkali developer by the action of an acid and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition.

REFERENCES:
patent: 6303266 (2001-10-01), Okino et al.
patent: 2002/0098441 (2002-07-01), Okino et al.
patent: 2003/0149225 (2003-08-01), Okino et al.
patent: 2003/0194640 (2003-10-01), Sato
patent: 2004/0043324 (2004-03-01), Okino et al.
patent: 2004/0202954 (2004-10-01), Momota et al.
patent: 2005/0147920 (2005-07-01), Lin et al.
patent: 2007/0134589 (2007-06-01), Yamamoto et al.
patent: 2007/0224539 (2007-09-01), Mizutani et al.
patent: 1 703 326 (2006-09-01), None
patent: 5-163265 (1993-06-01), None
patent: 2000-98612 (2000-04-01), None
patent: 2000-119588 (2000-04-01), None
patent: 2001-33971 (2001-02-01), None
patent: 2002-31890 (2002-01-01), None
patent: 2002-91002 (2002-03-01), None
Kim, J.-B., et al., “Synthesis and characterization of norbornene-based polymers with 7,7-dimethyloxepan-2-one acid labile groups for chemically amplified photoresists”, Polymer Communication, 2002, pp. 1963-1967, vol. 43.
Lee, J.-J., et al., “Novel Alicyclic Polymers Having 7,7-Dimethyloxepan-2-one Acid Labile Groups for ArF Lithography”, Proceedings of SPIE, 2002, pp. 110-119, vol. 4690, The International Society of Optical Engineering.
International Search Report (PCT/ISA/210) for PCT/JP2008/066444 dated Oct. 7, 2008, 5 pages.
Written Opinion (PCT/ISA/237) for PCT/JP2008/066444, dated Oct. 7, 2008, 6 pages.
Extended European Search Report dated Sep. 6, 2011 in European Application No. 08830724.4.

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