Positive photosensitive composition for use with an infrared las

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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G03F 7004

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active

061176133

ABSTRACT:
A positive photosensitive composition for use with an infrared laser comprises one or more alkali aqueous solution soluble polymer compounds (A) having in a molecule at least one group selected from a phenolic hydroxide group (a-1), a sulfonamide group (a-2), and an active imide group (a-3); a compound (B) which has an I/O value (Y) satisfying a relationship 0.05.ltoreq..vertline.X-Y.vertline..ltoreq.0.5 wherein X is an I/O value of the polymer compound (A), and which is compatible with the polymer compound (A) thereby lowering solubility of the polymer compound (A) into an alkali aqueous solution, an effect of lowering the solubility being reduced by heating; and a compound (C) which generates heat upon absorbing light. The photosensitive composition does not contain any compound having a thermal decomposition temperature of 150.degree. C. or less. Alternatively, the photosensitive composition may comprise a compound which generates heat upon absorbing light; an alkali aqueous solution soluble resin having a phenolic hydroxide group; and a compound represented by R.sup.1 CO--X--R.sup.2 (wherein X represents O, S or NR.sup.3 ; R.sup.1 represents an alkyl group or alkenyl group which has 6-32 carbon atoms, R.sup.2 and R.sup.3 represent a hydrogen atom, or an alkyl group or alkenyl group or aryl group each of which has 1-18 carbon atoms).

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Patent Abstracts Of Japan, vol. 005, No. 135 (M-085), Aug. 27, 1981 & JP 56 069192 A (Konishiroku Photo Ind Co Ltd), Jun. 10, 1981 *abstract*.

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