Positive photoresist compositions

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430311, 430325, G03C 1492

Patent

active

052524272

ABSTRACT:
The present invention provides an aqueous-processable, positive-working photoresist composition having improved photospeed and aqueous development rate without substantially reducing processing latitude in printed circuit chemistries. The compositions contain (a) a polymeric material having a polymer backbone with pendant acid labile groups which are bound directly or indirectly to the polymer backbone, and free acid groups, wherein the polymeric material has an acid number of about 25 and is substantially insoluble in 1% by weight aqueous sodium carbonate solution at 30.degree. C., and (b) a substance that forms an acid upon exposure to actinic radiation. The positive photoresists of this invention may be used to prepare printed circuits wherein the photoresist may be applied to the printed circuit substrate as a liquid coating, as a solid, dry film or from an electrodeposition bath.

REFERENCES:
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patent: 5023164 (1991-06-01), Brunsvold et al.
Printed Circuits Handbook, Coombs, Clyde F., Jr., 1979 Chapter 6, pp. 6-1 through 6-30.
Photoresist Materials and Processes, DeForest, W. S., 1975 Chapter 5, pp. 132-162.
Polymers and Copolymers of Unsaturated Tetrahydropyranyl Esters, Julie E. Kearns, et al., 1974; pp. 673-685.

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