Positive photoresist composition and method of forming...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S326000, C430S330000, C430S905000, C430S910000

Reexamination Certificate

active

07629105

ABSTRACT:
A positive resist composition that includes a resin component (A), which contains acid dissociable, dissolution inhibiting groups and exhibits increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid on exposure, wherein the resin component (A) is a copolymer (A1) containing a first structural unit (a1) derived from hydroxystyrene and a second structural unit (a2) derived from a (meth)acrylate ester having an alcoholic hydroxyl group, in which a portion of the hydroxyl groups of the structural units (a1) and the alcoholic hydroxyl groups of the structural units (a2) have been protected with the acid dissociable, dissolution inhibiting groups; and either the acid generator component (B) includes a diazomethane-based acid generator and an onium salt-based acid generator; or the composition further contains a compound, which contains at least one acid dissociable, dissolution inhibiting group, and generates an organic carboxylic acid under the action of acid generated from the component (B).

REFERENCES:
patent: 5216135 (1993-06-01), Urano et al.
patent: 5856561 (1999-01-01), Nagata et al.
patent: 5942367 (1999-08-01), Watanabe et al.
patent: 6048661 (2000-04-01), Nishi et al.
patent: 6084661 (2000-07-01), Mendelson et al.
patent: 6358666 (2002-03-01), Seo et al.
patent: 6368980 (2002-04-01), Minami et al.
patent: 6410204 (2002-06-01), Kodama et al.
patent: 6420082 (2002-07-01), Sato et al.
patent: 6458506 (2002-10-01), Cameron
patent: 6479211 (2002-11-01), Sato et al.
patent: 6485895 (2002-11-01), Choi et al.
patent: 6492086 (2002-12-01), Barclay et al.
patent: 6511794 (2003-01-01), Furukawa
patent: 6544715 (2003-04-01), Sato et al.
patent: 6627381 (2003-09-01), Uetani et al.
patent: 6667415 (2003-12-01), Yagihashi et al.
patent: 6723483 (2004-04-01), Oono et al.
patent: 7402372 (2008-07-01), Hagihara et al.
patent: 2002/0025495 (2002-02-01), Ogata et al.
patent: 2002/0164540 (2002-11-01), Nakanishi et al.
patent: 2003/0113661 (2003-06-01), Uetani et al.
patent: 2006/0251986 (2006-11-01), Sato et al.
patent: 2007/0042288 (2007-02-01), Hojo et al.
patent: 1099983 (2001-05-01), None
patent: 1400853 (2004-03-01), None
patent: 04-211258 (1992-08-01), None
patent: 07285918 (1995-10-01), None
patent: 08193052 (1996-07-01), None
patent: 08193054 (1996-07-01), None
patent: 08193055 (1996-07-01), None
patent: 08245515 (1996-09-01), None
patent: 11-119443 (1999-04-01), None
patent: 2000-086584 (2000-03-01), None
patent: 2000-188250 (2000-07-01), None
patent: 2000-356850 (2000-12-01), None
patent: 2001-228633 (2001-08-01), None
patent: 2001-272781 (2001-10-01), None
patent: 2004-333548 (2004-11-01), None
patent: 434458 (2001-05-01), None
patent: 499627 (2002-08-01), None
patent: 520464 (2003-02-01), None
patent: WO 2004/059392 (2004-07-01), None
Office Action issued on May 27, 2008, on the counterpart Japanese Application No. 2003-326146.
Office Action issued on May 27, 2008, on the counterpart Japanese Application No. 2004-119494.

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