Positive-acting radiation-sensitive mixture and recording materi

Details Positive-acting radiation-sensitive mixture and recording materi Positive-acting radiation-sensitive mixture and recording materi

1995-01-09

1996-03-12

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430326, 430191, G03C 1492

Patent

active

054985064

DESCRIPTION:

BRIEF SUMMARY
The invention relates to a positive-acting radiation-sensitive mixture comprising in aqueous alkaline solution, radiation and cleaved by an acid, invention furthermore relates to a recording material having a substrate and a radiation-sensitive coating.
The miniaturization of electronic components, for which a resolution to within the range of less than 1 .mu.m is required, was achieved essentially by novel lithographic techniques. The limit of the resolution is determined by the wavelength of the radiation used for reproducing the original. Short-wave radiation, such as high-energy UV, electron and X-ray radiation, is preferred. Accordingly, mixtures must be sufficiently sensitive to radiation of the wavelength used in each case. The article by C. G. Willson "Organic Resist Material--Theory and Chemistry [Introduction to Microlithography, Theory, Materials and Processing; Editors: L. F. Thompson, C. G. Willson and M. J. Bowden; ACS Symp. Ser. 219 (1983) 87; American Chemical Society, Washington] gives a survey of the requirements which radiation-sensitive mixtures have to meet.
In the production of positive photoresists, two-component mixtures comprising an alkali-soluble resin and a photosensitive quinonediazide compound were initially preferred. As a rule, a novolak was used as the alkali-soluble resin. The shelf life of such mixtures could be increased by adding primary, secondary and tertiary amino compounds or pyridine (DE-A 37 38 603). Owing to their absorption properties, such mixtures are, however, scarcely suitable for lithographic techniques which require the use of radiation having a wavelength of less than 300 nm.
So-called "chemically enhanced" systems are more suitable for such techniques. The chemical enhancement is based on the fact that an active agent, as a rule a Bronsted acid, is initially liberated from a "photoinitiator" by irradiation, and said agent then catalyzes a subsequent "dark reaction". These systems generally have high sensitivity. A distinction is made between two-component and three-component systems.
A two-component system comprises, for example, a photoinitiator and a polymer having acid-clearable bonds. The polymer is thus simultaneously a binder and an acid-cleavable compound. Any bases present in the surrounding air can penetrate into the resist layer, where they can neutralize the photolytically formed acid. A base concentration in the parts per billion (ppb) range in the air is sufficient to cause problems (S. A. MacDonald et al., Proc. SPIE--Int. Soc. Opt. Eng. 1991, 1466 (Adv. Resist Technol. Process. 8) and O. Nalamasu et al., Conference Reprints, SPE--Regional Technical Conference; Photopolymers: Principles, Processes and Materials, Ellenville, N.Y., 28.-30.10.1991, pages 225-234).
Three-component mixtures of the type stated in the introductory paragraph are already known, for example from DE-A 39 30 087 and DE-A 39 35 875.
The acid formed under the action of radiation cleaves the C-O-C or C-O-Si bonds of the compound c). The cleavage products formed thereby from the compound c) increase the solubility of the mixture in aqueous alkaline solution. In a coating applied to a substrate and containing or comprising this mixture, it is possible in this way to produce the image of an original. In order to obtain an image which is true to detail, the acid must not diffuse from the exposed parts of the coating into the unexposed parts thereof. This problem has already been recognized and described (L. Schlegel et al., J. Vac. Sci. Technol., B 9 (2) [1991] 278). It was found that the extent of the diffusion of the acid in the polymer matrix is dependent on a number of parameters. The temperatures at which a pre-bake and a post-exposure-bake take place and the glass transition temperature of the polymeric binder are of particular importance. In the systems investigated by L. Schlegel, the acid diffused to a distance of 520 nm. Diffusion occurs in the time span between the (imagewise) exposure and the development. The time span should be as short as possible, since otherwi

REFERENCES:
patent: 4387152 (1983-06-01), Stahlhofen
patent: 5106718 (1992-04-01), Bartmann et al.
patent: 5110708 (1992-05-01), Kim
patent: 5320931 (1994-06-01), Umehara et al.
patent: 5338641 (1994-08-01), Pawlowski et al.
patent: 5340682 (1994-08-01), Pawlowski et al.
patent: 5364734 (1994-11-01), Pawlowski et al.
Japanese Abstract JP 2029750 (Pub Apr. 12, 1990), (Patent Pub Jan. 31, 1990).
Japanese Abstract JP 4068355 (Derwent) (Patent Published Mar. 4, 1992).
Japanese Abstract JP 63149640 (Pub Jun. 22, 1988) (Patent Published Nov. 2, 1988).
Japanese Abstract JP 63149638 (Pub Jun. 22, 1988) (Patent Published Nov. 2, 1988).
Japanese Abstract JP 63149637 (Pub Jun. 22, 1988) (Patent Published Nov. 2, 1988).
MacDonald et al., "Airborne Chemical Contamination of a Chemically Amplified Resist", Advances in Resist Technology and Processing VIII, vol. 1466:2-12, (1991).
Nalamasu et al., "Effect of Post-Exposure Delay in Positive Acting Chemically Amplified Resists: An Analytical Study", SPE-Regional Technical Conference Photopolymers: Principles-Process and Materials, pp. 225-234, (1991).
Schlegel et al., "Determination of Acid Diffusion in Chemical Amplification Positive Deep Ultraviolet Resists", J. Vac. Sci. Technol., vol. 9(2):278-289, (1991).
Thompson et al., "Introduction to Microlithography; Theory, Materials and Processing", ACS Symposium Series 219, pp. 168-173 (1983).
Thompson et al., "Introduction to Microlithography; Theory, Materials, and Processing", ACS Symposium Series 219, pp. 89-159, (1983).

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