Position detecting method and apparatus

Etching a substrate: processes – Gas phase etching of substrate – With measuring – testing – or inspecting

Reexamination Certificate

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Details

C216S085000, C356S401000, C438S014000, C438S016000, C702S150000

Reexamination Certificate

active

10664998

ABSTRACT:
A two-dimensional image of an alignment mark30is acquired by an alignment scope15at step S61, and the two-dimensional image acquired at step S61is converted to a light-intensity signal line by line at step S62. A selection as to whether each line signal is valid or unnecessary is made at step S63. The amount of positional deviation of the alignment mark30is calculated using only valid line signals at step S64.

REFERENCES:
patent: 4962318 (1990-10-01), Nishi
patent: 5561606 (1996-10-01), Ota et al.
patent: 5754300 (1998-05-01), Magome et al.
patent: 5808910 (1998-09-01), Irie et al.
patent: 5986766 (1999-11-01), Koga et al.
patent: 6856931 (2005-02-01), Yoshida
patent: 2002/0042664 (2002-04-01), Kikuchi
patent: 8-94315 (1996-04-01), None

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