Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Polycrystalline semiconductor
Reexamination Certificate
2007-12-04
2007-12-04
Prenty, Mark V. (Department: 2822)
Semiconductor device manufacturing: process
Formation of semiconductive active region on any substrate
Polycrystalline semiconductor
C438S166000
Reexamination Certificate
active
11689668
ABSTRACT:
A method for forming a polysilicon structure is provided. An amorphous silicon structure with a first amorphous silicon region and a second amorphous silicon region is formed in a first region and a second region of a substrate, respectively. The first amorphous silicon region is thinner than the second amorphous silicon region. The amorphous silicon structure is crystallized to form the polysilicon structure with a first polysilicon region and a second polysilicon region corresponding to the first amorphous silicon region and the second amorphous silicon region.
REFERENCES:
patent: 5569936 (1996-10-01), Zhang et al.
patent: 6288412 (2001-09-01), Hamada et al.
patent: 6337232 (2002-01-01), Kusomoto et al.
patent: 7009207 (2006-03-01), Koo et al.
patent: 2002/0168577 (2002-11-01), Yoon
patent: 2002/0187569 (2002-12-01), Jung
patent: 2006/0006390 (2006-01-01), Hsu et al.
Hsu Chien-Chou
Hsu Tsung-Yi
AU Optronics Corp.
Prenty Mark V.
Thomas Kayden Horstemeyer & Risley
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