Polyparaxylylene film, production method therefor and...

Details Polyparaxylylene film, production method therefor and... Polyparaxylylene film, production method therefor and...

2005-09-20

2005-09-20

Zarneke, David (Department: 2891)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S778000, C438S025000, C438S026000, C257S636000, C257S635000, C257S637000, C428S516000, C427S545000

Reexamination Certificate

active

06946405

ABSTRACT:
An organic polymer film of low dielectric constant and high heating resistance which is applicable as an insulating layer of a semiconductor devices is provided, as well as a manufacturing method for the film and a semiconductor device incorporating the film.

REFERENCES:
patent: 3753773 (1973-08-01), Lee
patent: 3936531 (1976-02-01), Hofer
patent: 4321299 (1982-03-01), Frosch et al.
patent: 5268033 (1993-12-01), Stewart
patent: 5646440 (1997-07-01), Hasegawa
patent: 5858457 (1999-01-01), Brinker et al.
patent: 5945605 (1999-08-01), Julian et al.
patent: 5992228 (1999-11-01), Dunham
patent: 6459164 (2002-10-01), Nagerl et al.
patent: WO 00/06307 (2000-02-01), None
Buhler, Heat Resistant and Thermal Stable Polymer, Moscow Chemistry, 1984, (Russian Translation of Buhler, 1973, Academic Press, Berlin).
Lee, et al., New Linear Polymers, McGraw-Hill Book Company, 1967, pp. 74-76, New York.

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