Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-05-10
2005-05-10
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S780000, C438S781000
Reexamination Certificate
active
06890847
ABSTRACT:
Methods of providing foamed polynorbornene insulating material for use with an integrated circuit device, as well as apparatus and systems making use of such foamed polynorbornene insulating materials. The methods include forming a layer of polynorbornene material and converting at least a portion of the layer of polynorbornene material to a foamed polynorbornene material, such as by exposing the layer of polynorbornene material to a supercritical fluid. The foamed polynorbornene material can provide electrical insulation between conductive layers of the integrated circuit device.
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Estrada Michelle
Fourson George
Micro)n Technology, Inc.
Schwegman Lundberg Woessner & Kluth P.A.
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