Polymerizable, curable molding composition and a molding or coat

Details Polymerizable, curable molding composition and a molding or coat Polymerizable, curable molding composition and a molding or coat

1995-04-07

1996-12-31

Lusignan, Michael

Coating processes

Direct application of electrical, magnetic, wave, or...

Polymerization of coating utilizing direct application of...

427386, 427518, 427519, 427520, 522 8, 522103, 522170, B05D 306

Patent

active

055892302

ABSTRACT:
A polymerizable curable molding composition comprising (A) 100 parts by weight of an unsaturated epoxyester resin with an acid value below 3.0, (B) 10 to 40 parts by weight of a polymerizable monomer selected from the group consisting of phenoxyethyl acrylate, 2-acroyloxyethyl-2-hydroxypropyl phthalate and mixtures thereof and (C) 1 to 5 parts by weight of a mixture of hydroxyketone oligomer and 2-hydroxy-2-methyl-1-phenylpropan-1-one. The molding composition also preferably comprises 0.5 to 5 parts by weight of polystyrene microbeads. Also provided are a molding process using the polymerizable curable molding composition and a coating process using the polymerizable curing molding composition, each process being characterized by combined exposure of the composition to UV radiation and heating.

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Abstract of JP 57-108139, Jul. 1982.
Radtech Asia '91, Conf. Proc. (1991) 398-403.
Di Battista et al, "New Optimized Oligomeric Alpha Hydroxy Acetophenone Photo Initiator".

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