Polymeric compound containing a repeated unit having a...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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Details

C430S910000, C430S326000, C430S325000, C526S266000, C526S270000

Reexamination Certificate

active

07407733

ABSTRACT:
A polymeric compound of the invention includes at least one monomer unit represented by the following formula (I);wherein Rais a hydrogen atom, a halogen atom, an alkyl group of 1 to 6 carbon atoms or an haloalkyl group of 1 to 6 carbon atoms; each of R1and R2is identical to or different from a hydrogen atom or a hydrocarbon group, provided that at least one of R1and R2is a hydrocarbon group; R1and R2may be bonded together to form a ring with an adjacent carbon atom; and each of R3, R4, R5, R6, R7, R8and R9is identical to or different from a hydrogen atom or a hydrocarbon group. This polymeric compound has not only high substrate adhesion and high etching resistance but also high solubility for a resist solvent.

REFERENCES:
patent: 2003/0087183 (2003-05-01), Nishi et al.
patent: 2005/0014087 (2005-01-01), Nishimura et al.
patent: 2005/0089796 (2005-04-01), Funatsu et al.
patent: 2000-26446 (2000-01-01), None
patent: 2000-122294 (2000-04-01), None
patent: 2002-169289 (2002-06-01), None
patent: 2002-212174 (2002-07-01), None
patent: 2003-147023 (2003-05-01), None
patent: 2004-323704 (2004-11-01), None
patent: 2005-97533 (2005-04-01), None
Machine-assisted English translation of JP 2002-212174, provided by JPO.

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