Etching a substrate: processes – Etching of semiconductor material to produce an article...
Patent
1994-03-21
1995-09-05
Powell, William
Etching a substrate: processes
Etching of semiconductor material to produce an article...
216 49, 216 58, 216 83, 73488, 359295, 437228, 437927, B44C 122, B29C 3700, C23F 100
Patent
active
054476003
ABSTRACT:
A method for reducing sticking between contacting elements in a micromechanical device is disclosed. In addition, a micromechanical device is disclosed wherein the elements of the device are less likely to stick. The method for reducing sticking in a micromechanical device (10) comprises forming a protective layer (26) on a first contact element (14) to reduce the likelihood of a first contacting element (14) sticking to another contacting element (20). The protective layer (26) may be formed of a fluoro-polymer such as Teflon-AF.
REFERENCES:
patent: 4172757 (1979-10-01), Thornburg
patent: 4293377 (1981-10-01), Miyajima
patent: 5216537 (1993-06-01), Hornbeck
patent: 5298114 (1994-03-01), Takeshita
Donaldson Richard L.
Grossman Rene E.
Powell William
Reed Julie L.
Texas Instruments
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