Polymer, resist composition, and patterning process

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S326000, C430S907000, C430S910000, C526S245000, C526S246000

Reexamination Certificate

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11051721

ABSTRACT:
A chemically amplified resist composition using an alternating copolymer of α-trifluoroacrylic acid with norbornene as a base polymer lends itself to ArF laser lithographic micropatterning and is improved in transparency, plasma etching resistance, and line edge roughness.

REFERENCES:
patent: 6919161 (2005-07-01), Hatakeyama et al.
patent: 2001/0010890 (2001-08-01), Hatakeyama et al.
patent: 2001/0018162 (2001-08-01), Hatakeyama et al.
patent: 2001/0033989 (2001-10-01), Harada et al.
patent: 2002/0161148 (2002-10-01), Harada et al.
patent: 2003/0165773 (2003-09-01), Harada et al.
patent: 63-27829 (1988-02-01), None
patent: 2-27660 (1990-06-01), None
patent: 9-73173 (1997-03-01), None
patent: 9-230595 (1997-09-01), None
patent: 10-10739 (1998-01-01), None
patent: WO-97/33198 (1997-09-01), None
Azuma et al., Proceedings of SPIE vol. 3999 (2000), pp. 264-269.
Kwong et al., Proceedings of SPIE, vol. 3678, pp. 1209-1214 (Mar. 1999).
Bae et al., Proceedings of SPIE, vol. 5039 (2000), pp. 665-671.
Hatakeyama et al., Proceedings of SPIE, vol. 5039 (2003) pp. 672-681.

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