Polymer, resist composition and patterning process

Details Polymer, resist composition and patterning process Polymer, resist composition and patterning process

2006-11-14

2006-11-14

Lee, Sin (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C430S330000, C430S313000, C526S279000, C526S266000, C526S270000, C526S273000

Reexamination Certificate

active

07135269

ABSTRACT:
A polymer comprising recurring units containing silicon and recurring units having a substituent group of formula (1) is novel wherein A1is a divalent group selected from furandiyl, tetrahydrofurandiyl and oxanorbornanediyl, R1and R2are selected from monovalent C1–C10hydrocarbon groups, or R1and R2taken together may form an aliphatic hydrocarbon ring with the carbon atom, and R3is hydrogen or a monovalent C1–C10hydrocarbon group which may contain a hetero atom. The polymer is useful as a base resin to formulate a resist composition which is sensitive to high-energy radiation, and has excellent sensitivity and resolution at a wavelength of less than 300 nm as well as satisfactory oxygen plasma etching resistance.

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