Polymer remover/photoresist stripper

Details Polymer remover/photoresist stripper Polymer remover/photoresist stripper

1998-06-03

2000-03-28

Baxter, Janet

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Finishing or perfecting composition or product

134 38, 510176, B08B 700, C11D 904, G03F 742

Patent

active

060430052

ABSTRACT:
A chemical composition which is useful for removing photoresist and polymers from substrates. The composition comprises 10 to 90% by weight of 2-pyrrolidinone compound of the formula C.sub.5 H.sub.9 NO, 10 to 50% by weight of lactic acid of the formula C.sub.3 H.sub.6 O.sub.3, and 10 to 50% by weight of a peroxide compound. The composition of the present invention is particularly useful for cleaning photoresist and removing tough polymers from semiconductor wafer substrates.

REFERENCES:
patent: 4744834 (1988-05-01), Haq
patent: 5215675 (1993-06-01), Wilkins et al.
patent: 5290365 (1994-03-01), Whitton
patent: 5334331 (1994-08-01), Fusiak
patent: 5597678 (1997-01-01), Honda et al.
patent: 5830836 (1998-11-01), Smith et al.
patent: 5911836 (1999-06-01), Hada et al.

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