Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2005-05-10
2005-05-10
Walke, Amanda (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S286100, C430S311000, C430S313000, C430S330000, C438S780000
Reexamination Certificate
active
06890699
ABSTRACT:
The invention relates to a polymer obtained by copolymerization of a first comonomer having a group catalytically cleavable by acid, a second comonomer having an anchor group for the subsequent linkage of an amplification agent, and a third comonomer having a carboxyl group being esterified with an alkyl group. It is also possible for one or more carbon atoms in the alkyl group to be replaced by oxygen. The polymer may also include fourth comonomers that include silicon-containing groups. By using the alkyl or alkoxyalkyleneoxy side groups introduced with the third comonomer, the glass transition temperature of the polymer can be reduced so that a photoresist containing the polymer provides a homogeneous polymer film on heating.
REFERENCES:
patent: 5234793 (1993-08-01), Sebald et al.
patent: 6165682 (2000-12-01), Foster et al.
patent: 6171755 (2001-01-01), Elian et al.
patent: 6291129 (2001-09-01), Shida et al.
patent: 6410748 (2002-06-01), Shida et al.
patent: 6514663 (2003-02-01), Hien et al.
patent: 6517993 (2003-02-01), Nakamura et al.
patent: 6555289 (2003-04-01), Sasaki et al.
patent: 101 34 163 (2002-01-01), None
patent: 101 34 162 (2002-04-01), None
patent: 0 395 917 (1990-11-01), None
patent: 0 919 867 (1999-06-01), None
patent: 11231542 (1999-08-01), None
English language translation of JP 11-231542.*
Choi, S.-J. et al.: “Design and Synthesis of New Photoresist Materials for ArF Lithograhpy”, Advances in Resist Technology and Processing XVII, Proceedings of SPIE, vol. 3999, 2000, pp. 54-61.
Kirch Oliver
Seibold Kerstin
Greenberg Laurence A.
Infineon - Technologies AG
Mayback Gregory L.
Stemer Werner H.
Walke Amanda
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