Polymer for positive photoresist and chemical amplified positive

Details Polymer for positive photoresist and chemical amplified positive Polymer for positive photoresist and chemical amplified positive

1997-09-26

1999-10-05

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430170, 430905, 430910, 526314, 52631841, 526326, G03F 7004

Patent

active

059621850

ABSTRACT:
A positive chemical amplified photoresist composition having as a matrix resin a polymer having the repeating unit of Formula (I) and a photoacid generator. The polymer ranges, in polystyrene-reduced weight average molecular weight, from about 2,000 to 1,000,000. The photoresist composition is possible to develop in alkali and shows excellent sensitivity, resolution and transmissivity to deep uv light in addition to being superior in storage preservativity. The repeating unit of Formula (I) is: ##STR1## wherein, R.sub.2, R.sub.2 and R.sub.3 are independently represented by a hydrogen atom or a methyl group; R.sub.4 is a hydrogen atom, an alkyl group or an alkoxy group; R.sub.5 is functions as an acid-labile protective group and is selected from a t-butyl group, a tetrahydropyranyl group or an alkoxymethylene group; j is an integer of 1-8; k is an integer of 0-8; and 1, m and n each represent a mole ratio, satisfying the condition of l+m+n=1 where 0<1<0.4.

REFERENCES:
patent: 4876173 (1989-10-01), Maemoto et al.
patent: 4925768 (1990-05-01), Iwasaki et al.
patent: 5070001 (1991-12-01), Stahlhofen
patent: 5558978 (1996-09-01), Schadeli et al.
patent: 5705570 (1998-01-01), Burns et al.

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