Polymer for positive photoresist and chemical amplification posi

Details Polymer for positive photoresist and chemical amplification posi Polymer for positive photoresist and chemical amplification posi

1998-04-08

2000-05-16

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430905, 430910, 526272, 526283, G03F 7004

Patent

active

060635428

ABSTRACT:
A polymer having a repeating unit represented by the following general formula I and a chemical amplification positive photoresist composition comprising the copolymer and a photoacid generator. The hydroxy group introduced into the polymer gives a great contribution to the adhesiveness of the composition to substrate and allows the composition to be applied to any substrate. In addition, the photoresist composition is superior in resolution, thermal resistance, etch resistance, and post-exposure storage stability and can be developed without changing the concentration of developing solution. ##STR1##

REFERENCES:
patent: 5585219 (1996-12-01), Kaimoto et al.
patent: 5635332 (1997-06-01), Nakano et al.
patent: 5843624 (1998-12-01), Houlihan et al.

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