Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1997-10-10
1999-10-05
Chu, John S.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430905, 430910, 526313, 526314, G03F 7004, C08F21202
Patent
active
059621869
ABSTRACT:
A positive chemical amplified photoresist composition comprising as a matrix resin a polymer having the repeating unit of Formula (I) and a photoacid generator. The polymer ranges, in polystyrene-reduced weight average molecular weight, from about 2,000 to 1,000,000. The photoresist composition is possible to develop in alkali and shows excellent sensitivity, resolution and transmissivity to deep uv light in addition to being superior in storage preservativity. The repeating unit is: ##STR1## wherein, R.sub.1, R.sub.2 and R.sub.3 are independently represented by a hydrogen atom or a methyl group; R.sub.4 is a hydrogen atom, an alkyl group or an alkoxy group; R.sub.5, R.sub.6 and R.sub.7 are independently represented by a hydrogen atom, a methyl group, an ethyl group, a t-butyl group, a tetrahydropyranyl group or an alkoxymethylene group; j is an integer of 1-8; k is an integer of 0-8; and l, m and n each represent a mole ratio, satisfying the condition of 1=0.1.about.0.5/l+m+n, m=0.3.about.0.8/l+m+n, n=0.1.about.0.4/l+m+n and l+m+n+l. The acid labile protective group can be the t-butyl group, the tetrahydropyranyl group or the alkoxymethylene group.
REFERENCES:
patent: 5558978 (1996-09-01), Schadeli et al.
patent: 5679495 (1997-10-01), Yamachika et al.
patent: 5750309 (1998-05-01), Hatakeyama et al.
patent: 5770345 (1998-06-01), Babich et al.
Kim Ji Hong
Kim Ki Dae
Kim Seong Ju
Park Joo Hyeon
Chu John S.
Korea Kumho Petrochemical Co. Ltd.
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