Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-08-17
2010-10-26
Walke, Amanda C. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S311000, C430S913000, C430S914000, C430S927000, C430S945000, C560S220000, C526S072000
Reexamination Certificate
active
07820360
ABSTRACT:
There are provided a polymer compound which can form a resist pattern with excellent resolution, and a negative resist composition containing the polymer compound and a resist pattern-forming method thereof.The present invention is a polymer compound containing a structural unit (a0) represented by a general formula (a0-1) shown below.(wherein, R represents a hydrogen atom, a halogen atom, an alkyl group or a halogenated alkyl group; and R0represents an alkyl group containing a hydroxyl group.)Also, the present invention is a negative resist composition, including: an alkali soluble resin component (A), an acid generator component (B) that generates acid upon exposure, and a cross-linking agent (C), wherein the alkali soluble resin component (A) contains a polymer compound (A1) having a structural unit (a0) represented by the general formula (a0-1) shown above.
REFERENCES:
patent: 5204225 (1993-04-01), Feely
patent: 5945517 (1999-08-01), Nitta et al.
patent: 6180313 (2001-01-01), Yukawa et al.
patent: 6306555 (2001-10-01), Schulz et al.
patent: 6806026 (2004-10-01), Allen et al.
patent: 6846609 (2005-01-01), Uetani et al.
patent: 7183368 (2007-02-01), Hada et al.
patent: 7402712 (2008-07-01), Hatakeyama et al.
patent: 7528279 (2009-05-01), Hatakeyama et al.
patent: 2007/0129532 (2007-06-01), Hatakeyama et al.
patent: 2009/0099326 (2009-04-01), Okada et al.
patent: 2009/0149665 (2009-06-01), Okada et al.
patent: 1 557 718 (2005-07-01), None
patent: H08-3635 (1996-01-01), None
patent: H09-208554 (1997-08-01), None
patent: H11-035551 (1999-02-01), None
patent: H11-035552 (1999-02-01), None
patent: H11-035573 (1999-02-01), None
patent: H11-322707 (1999-11-01), None
patent: 2000-206694 (2000-07-01), None
patent: 2000-275843 (2000-10-01), None
patent: 2004-029053 (2004-01-01), None
patent: 2004-272227 (2004-09-01), None
patent: A-2005-003863 (2005-01-01), None
patent: 2005-43852 (2005-02-01), None
patent: 2005-208527 (2005-08-01), None
patent: 2005220066 (2005-08-01), None
patent: 2007055966 (2007-03-01), None
patent: 2007131582 (2007-05-01), None
patent: 200421024 (2004-10-01), None
patent: WO 2004/074242 (2004-09-01), None
patent: WO 2005/075406 (2005-08-01), None
Machine translation of JP 2005-220066A (2007).
International Search Report in connection with corresponding PCT application No. PCT/JP2006/316160, Oct. 10, 2006.
Tsuchiya et al.,Investigation of Acid-Catalyzed Insolubilization Reactions for Alicyclic Polymers with Carboxyl Groups,Journal of Photopolymer Science and Technology, vol. 10 No. 4, pp. 579-584 (1997).
Maeda et al.,ArF Chemically Amplified Negative Resist Using Alicyclic Epoxy Polymer,Journal of Photopolymer Science and Technology, vol. 11 No. 3, pp. 507-512 (1998).
Iwasa et al.,Novel Negative Photoresist Based on Polar Alicylic Polymers for ArF Excimer Laser Lithography,SPIE Advances in Resist Technology and Processing XIV, vol. 3333, pp. 417-424 (1998).
Conley et al.,Negative Photoresist for 157 nm Microlithography; A Progress Report,SPIE Advances in Resist Technology and Processing XIX, vol. 4690, pp. 94-100 (2002).
Office Action issued on counterpart Taiwanese Patent Application No. 095130685, dated Oct. 16, 2009.
An Office Action issued on counterpart Taiwanese Patent Application No. 095130685, dated Jul. 12, 2010.
Iwashita Jun
Kusaka Ayako
Knobbe Martens Olson & Bear LLP
Tokyo Ohka Kogyo Co. Ltd.
Walke Amanda C.
LandOfFree
Polymer compound, negative resist composition, and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polymer compound, negative resist composition, and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polymer compound, negative resist composition, and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4236430