Polyimide embedded conductor process

Details Polyimide embedded conductor process Polyimide embedded conductor process

1985-02-19

1987-03-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156233, 156652, 156656, 156668, 156902, 29846, C23F 100, C23F 102, B44C 122, B29C 3700

Patent

active

046505458

ABSTRACT:
A polyimide embedded conductor process assures adherence of a metal conductor to a polyimide layer and allows closer spacing between conductors. The conductor is laid on a sacrificial substrate, and then the polyimide layer is laid over the conductor and substrate. The substrate is etched away to expose the conductor, and the polyimide layer may be etched away from the conductor to form attachment tabs.

REFERENCES:
patent: 3039177 (1962-06-01), Burdett
patent: 3350250 (1967-10-01), Sanz et al.
patent: 3711625 (1973-01-01), Dupuis
patent: 4125441 (1978-11-01), Dugan
patent: 4141782 (1979-02-01), Dugan et al.
patent: 4231154 (1980-11-01), Gazdik et al.
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4396457 (1983-08-01), Bakermans
patent: 4517051 (1985-05-01), Gazdik et al.

Affiliated with

Also associated with

Rating

Polyimide embedded conductor process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyimide embedded conductor process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide embedded conductor process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1787018