Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2005-03-15
2009-08-25
Woodward, Ana L (Department: 1796)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C428S458000, C428S473500, C430S281100, C430S906000, C430S916000, C430S926000
Reexamination Certificate
active
07579134
ABSTRACT:
The present invention is directed to coverlay compositions derived from two-layer polyamic acid-based composites having a cover layer and adjacent thereto an adhesive layer wherein the cover layer comprises polyamic acid and other additives allowing the composition to be photosensitive and aqueous base developable, and where the adhesive layer can form a polyimide having a glass transition temperature between 170 and 250° C. The two-layer coverlay compositions of the present invention are used to encapsulate metal circuit traces formed on a flexible printed circuit base substrate. These two-layer compositions are particularity useful due to having an overall in-plane CTE between 10 and 40 ppm/° C. a range that is useful in avoiding unwanted curling of a flexible printed circuit when used as a polyimide-based coverlay material.
REFERENCES:
patent: 2850445 (1958-09-01), Oster
patent: 2875047 (1959-02-01), Oster
patent: 3074974 (1963-01-01), Gebura
patent: 3097096 (1963-07-01), Oster
patent: 3097097 (1963-07-01), Oster
patent: 3145104 (1964-08-01), Oster et al.
patent: 3390996 (1968-07-01), MacLachlan
patent: 3427161 (1969-02-01), Laridon
patent: 3479185 (1969-11-01), Chambers
patent: 3549367 (1970-12-01), Chang et al.
patent: 3554753 (1971-01-01), Cohen
patent: 3563750 (1971-02-01), Walker
patent: 3563751 (1971-02-01), Cohen
patent: 3579339 (1971-05-01), Chang et al.
patent: 3622334 (1971-11-01), Hurley
patent: 3645772 (1972-02-01), Lester et al.
patent: 3647467 (1972-03-01), Grubb
patent: 3652275 (1972-03-01), Baum et al.
patent: 3784557 (1974-01-01), Cescon
patent: 4064287 (1977-12-01), Lipson et al.
patent: 4071367 (1978-01-01), Collier et al.
patent: 4127436 (1978-11-01), Friel
patent: 4162162 (1979-07-01), Dueber
patent: 4168982 (1979-09-01), Pazos
patent: 4230793 (1980-10-01), Losert et al.
patent: 4268667 (1981-05-01), Anderson
patent: 4311783 (1982-01-01), Dessauer
patent: 4341860 (1982-07-01), Sysak
patent: 4351893 (1982-09-01), Anderson
patent: 4376815 (1983-03-01), Oddi et al.
patent: 4454218 (1984-06-01), Dueber et al.
patent: 4535052 (1985-08-01), Anderson
patent: 4565769 (1986-01-01), Dueber et al.
patent: 4622286 (1986-11-01), Sheets
patent: 4710262 (1987-12-01), Weed
patent: 4772534 (1988-09-01), Kawamura et al.
patent: 4772541 (1988-09-01), Gottschalk et al.
patent: 4774163 (1988-09-01), Higashi
patent: 5336925 (1994-08-01), Moss et al.
D.F. Eaton, Dye Sensitized Photopolymerization, Adv. In Photochemistry, vol. 13, 1986, pp. 427-487.
Auman Brian C.
Dueber Thomas Eugene
Kanakarajan Kuppusamy
E. I. Dupont de Nemours and Company
Woodward Ana L
LandOfFree
Polyimide composite coverlays and methods and compositions... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polyimide composite coverlays and methods and compositions..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide composite coverlays and methods and compositions... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4136854