Polyconductor line end formation and related mask

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S592000, C257SE21039

Reexamination Certificate

active

07465615

ABSTRACT:
Methods of forming adjacent polyconductor line ends and a mask therefor are disclosed. In one embodiment, the method includes forming a polyconductor layer over an isolation region; forming a mask over the polyconductor layer, the mask including shapes to create the polyconductor line ends and a correction element to ensure a designed proximity of the polyconductor line ends; and etching the polyconductor layer using the patterned photoresist mask to create the adjacent polyconductor line ends, wherein the correction element is removed during the etching.

REFERENCES:
patent: 4343877 (1982-08-01), Chiang
patent: 6034877 (2000-03-01), Bronner et al.
patent: 6430733 (2002-08-01), Cohn et al.
patent: 6593631 (2003-07-01), Lee et al.
patent: 2005/0271949 (2005-12-01), Corboy et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polyconductor line end formation and related mask does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyconductor line end formation and related mask, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyconductor line end formation and related mask will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4025158

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.