Polycide film

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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Details

257369, 257374, 257383, 257384, 257408, 257751, 257754, 257757, 438396, 438397, H01L 2978, H01L 2128

Patent

active

058180923

ABSTRACT:
A method of forming a polycide thin film. First, a silicon layer is formed. Next, a thin barrier layer is formed on the first silicon layer. A second silicon layer is then formed on the barrier layer. Next, a metal layer is formed on the second silicon layer. The metal layer and the second silicon layer are then reacted together to form a silicide.

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Wolf, et al.; "Chemical Vapor Deposition of Amorphous and Polycrystalline Films"; 1986; Silicon Processing for the VLSI Era; vol. 1; pp. 175-180, 397-399.
Murarka; "Refractory Silicides for Integrated Circuits"; J. Vac. Sci. Technol., 17(4), Jul./Aug. 1980; pp. 775-792.
Wolf; "Silicon Processing for the VLSI Era"; vol. 3: the Submicron MOSFET; 1995; pp. 228-231, 616-621.
Ghandhi; "VLSI Fabrication Principles Silicon and Gallium Arsenide"; 1983; pp. 371-373.
Zong, et al.; "Materials and Process Characterization for VLSI"; 1988 (ICMPC '88); World Scientific; pp. 474-475.

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