Polyamic acid resin composition

Details Polyamic acid resin composition Polyamic acid resin composition

2005-08-09

2005-08-09

Walke, Amanda C. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S281100, C430S283100, C430S005000, C430S311000, C430S330000, C522S173000, C522S038000, C522S038000

Reexamination Certificate

active

06927012

ABSTRACT:
Provided is a polyamic acid resin composition for formation of a bank, which provides excellent film characteristics and adhesion to a substrate, which can undergo patterning with use of a positive type photoresist, and which can be transformed into a polyimide after the patterning to yield a polyimide resin with upper part of film having a low surface energy. It is achieved by a polyamic acid resin composition comprising a polyamic acid [a] as a base and a polyamic acid [b] having a fluorine-containing alkyl group with a carbon number of at least 2, and containing the polyamic acid [b] in an amount of from 0.1 to 30 wt % to the total amount of the polyamic acid [a] and the polyamic acid [b].

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