Poly-silicon thin film transistor having back bias effects...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S403000

Reexamination Certificate

active

06936504

ABSTRACT:
A poly-silicon (poly-Si) thin film transistor (TFT) having a back bias effect is provided in order to enhance characteristics of a leakage current, a sub-threshold slope, and an on-current. The poly-Si TFT includes a glass substrate, an island type buried electrode pad formed of an conductive material on one side of the glass substrate where the back bias voltage is applied, a buffer layer formed of an insulation material on the whole surface of the glass substrate, and a poly-Si TFT formed on the upper portion of the buffer layer. A method of fabricating the TFT is also provided.

REFERENCES:
patent: 5356824 (1994-10-01), Chouan et al.
patent: 5801395 (1998-09-01), Lee et al.
patent: 5982004 (1999-11-01), Sin et al.
patent: 6194282 (2001-02-01), Niimi et al.
patent: 6396079 (2002-05-01), Hayashi et al.
Wolf, “Silicon Processing for the VLSI Era”, vol. 2, pp. 183-186, 237-238, 398-399.

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