Polishstop planarization method and structure

Details Polishstop planarization method and structure Polishstop planarization method and structure

1993-04-22

1994-10-18

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

437195, H01L 2144, H01L 21465

Patent

active

053565134

ABSTRACT:
The invention provides a method for producing a substantially planar surface overlying features of a semiconductor structure. The method comprises forming alternating layers of a hard polishing material and a soft polishing material over the features of the semiconductor structure, and then polishing the alternating layers to form a substantially planar surface over the features. The method takes advantage of the polish rates of the various materials used as alternating layers to enhance the planarization process.

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