Polishing system and method with polishing pad pressure adjustme

Details Polishing system and method with polishing pad pressure adjustme Polishing system and method with polishing pad pressure adjustme

1998-04-21

2000-10-31

Eley, Timothy V.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 11, 451 57, 451170, 451274, 451287, B24B 4900

Patent

active

061394009

ABSTRACT:
Disclosed is a polishing system used for polishing a surface to be polished of an object to be polished by a polishing pad, which is capable of improving uniformity of the surface to be polished of the object to be polished by positively, accurately adjusting a polishing pressure, and a polishing method using the polishing system. Concretely, the surface to be polished of a wafer as the object to be polished is polished by relatively moving, along a plane, a polishing surface of the rotating polishing pad and the surface to be polished of the wafer in slide-contact with each other, and adjusting a pressing force applied from the polishing pad to the wafer in accordance with a polishing pressure previously set depending on a relative-positional relationship between the polishing surface of the polishing pad and the surface to be polished of the wafer.

REFERENCES:
patent: 5035087 (1991-07-01), Nishiguchi et al.
patent: 5317837 (1994-06-01), Stahli
patent: 5679060 (1997-10-01), Leonard et al.
patent: 5679212 (1997-10-01), Kato et al.
patent: 5816895 (1998-10-01), Honda
patent: 5944580 (1999-08-01), Kim et al.

Affiliated with

Also associated with

Rating

Polishing system and method with polishing pad pressure adjustme does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing system and method with polishing pad pressure adjustme, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing system and method with polishing pad pressure adjustme will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2045315