Polishing system

Abrading – Precision device or process - or with condition responsive... – With indicating

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451 65, 451 21, B24B 3704

Patent

active

061100080

ABSTRACT:
A polishing method characterized by measuring the thickness of a film of a monitoring piece to be polished which is to be used exclusively for monitoring polishing amount, and obtaining polishing amount on the basis of the results of measurement, and judging, on the basis of the resulting polishing amount, setting/change of polishing condition of a polishing object, whether it is necessary or not to replace a polishing pad, and/or completion of run-in polishing after replacement of the polishing pad, and an apparatus to be used for practicing same.

REFERENCES:
patent: 4407094 (1983-10-01), Bennett et al.
patent: 4910155 (1990-03-01), Cote et al.
patent: 5433650 (1995-07-01), Winebarger
patent: 5492594 (1996-02-01), Burke et al.
patent: 5672091 (1997-09-01), Takahashi et al.

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