Abrading – Machine – Rotary tool
Reexamination Certificate
2005-01-11
2005-01-11
Wilson, Lee D. (Department: 3723)
Abrading
Machine
Rotary tool
C451S041000, C451S056000, C451S060000, C451S286000, C451S287000, C451S288000, C451S289000, C451S443000, C451S444000, C451S446000
Reexamination Certificate
active
06840846
ABSTRACT:
An apparatus for polishing a wafer includes a polishing station having a platen on which a polishing pad is installed, a polishing head having a membrane that contacts a surface of the wafer, the membrane securing the wafer and pressuring the wafer against the polishing pad, wherein the polishing station includes a transfer stage for loading the wafer on or unloading the wafer from the polishing head, and wherein the transfer stage includes a pedestal on which the wafer is placed and a fluid supply part for supplying a fluid into a boundary region between the wafer and the membrane to reduce a surface tension between the wafer and the membrane. Preferably, the apparatus further includes a stopper for preventing the wafer placed on the pedestal from being lifted up along with the membrane when the wafer is unloaded from the polishing head onto the pedestal.
REFERENCES:
patent: 6126517 (2000-10-01), Tolles et al.
patent: 6537143 (2003-03-01), Yang et al.
patent: 8-229807 (1996-09-01), None
Boo Jae-Phil
Lee Hyun-Sung
Ryu Jun-Gyu
Lee & Sterba, P.C.
McDonald Shantese
Samsung Electronics Co,. Ltd.
Wilson Lee D.
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