Polishing slurry for aluminum-based metal, and method of...

Details Polishing slurry for aluminum-based metal, and method of... Polishing slurry for aluminum-based metal, and method of...

2006-05-30

2006-05-30

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Planarizing a nonplanar surface

C216S017000, C216S018000, C438S691000, C438S692000, C252S079100

Reexamination Certificate

active

07052620

ABSTRACT:
A polishing slurry for an aluminum-based metal includes an oxidizing agent having a standard electrode potential of 1.7 V or more, amino acid or amino acid compound, and bi- or higher than bi-valent aromatic carboxylic acid having a carbocycle or a heterocycle.

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Japanese Patent Office Notification of Reasons for Rejection and English translation thereof. Application No. 2002064210.

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