Polishing slurry compositions capable of providing multi-modal p

Details Polishing slurry compositions capable of providing multi-modal p Polishing slurry compositions capable of providing multi-modal p

1998-08-07

2000-07-25

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438692, 438693, 438745, 438753, 438754, H01L 21304

Patent

active

060936495

ABSTRACT:
Water based polishing slurries, comprising oxide polishing particles. The polishing slurries comprise an innovative (multi-modal) particle distribution for improved polishing performance.

REFERENCES:
patent: 5302233 (1994-04-01), Kim et al.
patent: 5389194 (1995-02-01), Rostoker et al.
patent: 5527423 (1996-06-01), Neville et al.
patent: 5626715 (1997-05-01), Rostoker

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