Polishing pads including slurry and chemicals thereon and...

Details Polishing pads including slurry and chemicals thereon and... Polishing pads including slurry and chemicals thereon and...

2004-08-20

2011-11-22

Eley, Timothy V (Department: 3723)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C051S297000, C051S309000, C451S533000, C451S539000

Reexamination Certificate

active

08062102

ABSTRACT:
Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.

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Korean Intellectual Office, “Notice to File a Response/Amendment to the Examination Report” corresponding to Korean Patent application 10-2003-0060261, mailed Jul. 28, 2005.

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